WELDTONE® underfill products are one-component, heat-curable, reworkable epoxy adhesives. These products are designed to improve the reliability for fine–pitch Chip Scale Package (CSP) , Wafer Level Chip Scale Package(WLCSP) and Ball Grid Array(BGA) assembly. For  the CSP components, our products can be dispensed or jetted at room temperature（25℃）. The adhesive can quickly flow to the appropriate distance, suitable for automated assembly lines without too much extra procedures.

Product characteristics:

• Fast cure at low temperature
• Excellent reliability
• Fast flow at room temperature and suitable for automatic assembly lines
• Reworkable
• Meet environmental protection requirements including RoHS，halogen-free and Reach etc.
• Quick response and customize products for customer requirements