GOUSHOU TECHNOLOG

Structural Adhesive for Electronic

Polyurethane hot melt adhesives

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Weldbond® has developed a variety of PUR products for touch panel assembly, structural parts assembly and small electronic components assembly in intelligent electronic products. These adhesives offer high bonding strength, good toughness and excellent reliability. For samrt speaker and receiver assembly, our PUR products offer unique features including good flowability, excellent sealing performance and perfect reliability. For the LCM edge bonding application, our products offer low viscosity, fast curing, good light blocking and excellent bonding strength. Weldbond® original Quick-Settle technology brings the revolutionary breakthrough for rapid automated assembly lines in a series of application fields.

  • Product characteristics:
    • Single-component,100% solid content and moisture cure
    • High initial strength
    • Good adhesion to a variety of substrates including plastics and metals
    • Good toughness and excellent performance in impact resistance tests
    • Excellent thermal stability
    • Excellent performance in heat-damp tests and thermal shock tests
    • Good resistance to chemicals
    • Meet environmental protection requirements including RoHS, Halogen-free and Reach etc.
    • Quick response and customize products for customer requirements

 

Low temperature curable epoxy adhesives

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Weldbond® LTCA products are one-component and low temperature curable epoxy adhesives, which can cure at low temperature and offer excellent bonding strength and perfect reliability. They are mainly applied in bonding reinforcement, waterproof sealing and components protection for intelligent electronic products. These adhesives also can be compatible with heat-sensitive electronic components. For fingerprint module assembly and camera module assembly, Weldbond® products can cure fast at low temperature and offer high bonding strength, low shrinkage and excellent reliability performance.

  • Product characteristics:
    • Fast cure at low temperature
    • Good adhesion to plastics and metals
    • Good toughness and excellent impact resistance
    • Good flowability and suitable for automated assembly line
    • Easy to rework
    • Meet environmental protection requirements including RoHS,halogen-free and Reach etc.
    • Quick response and customize products for customer requirements

 

Underfill adhesives

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Weldbond® underfill products are one-component, heat-curable, reworkable epoxy adhesives. These products are designed to improve the reliability for fine–pitch Chip Scale Package (CSP) , Wafer Level Chip Scale Package(WLCSP) and Ball Grid Array(BGA) assembly. For  the CSP components, our products can be dispensed or jetted at room temperature(25℃). The adhesive can quickly flow to the appropriate distance, suitable for automated assembly lines without too much extra procedures.

  • Product characteristics:
    • Fast cure at low temperature
    • Excellent reliability
    • Fast flow at room temperature and suitable for automatic assembly lines
    • Reworkable
    • Meet environmental protection requirements including RoHS,halogen-free and Reach etc.
    • Quick response and customize products for customer requirements

 

UV curable adhesives

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Weldbond® UV curable adhesives can cure fast under UV light.  Our products offer good adhesion to a variety of materials,excellent reliability and are especially suitable for high-speed automated assembly lines. Weldbond® UV adhesives are mainly applied in bonding reinforcement, waterproof sealing and components protection for intelligent electronic products. For FPC reinforcement application,our UV products offer good toughness, high bonding strength and excellent reliability. For waterproof sealing in mobile phone, we also develop a series of unique UV products which provide excellent reliability and are easy to rework. Particularly, we design one re-workable UV product to protect high gloss metal surface among IPAD production process.

  • Product characteristics:
    • Fast cure and suitable for high-speed automatic assembly lines
    • Good adhesion to plastics, glasses and metals etc.
    • Meet environmental protection requirements including RoHS,halogen-free and Reach etc.
    • Quick response and customize products for customer requirements

 

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