Weldbond® has developed a variety of PUR products for touch panel assembly, structural parts assembly and small electronic components assembly in intelligent electronic products. These adhesives offer high bonding strength, good toughness and excellent reliability. For samrt speaker and receiver assembly, our PUR products offer unique features including good flowability, excellent sealing performance and perfect reliability. For the LCM edge bonding application, our products offer low viscosity, fast curing, good light blocking and excellent bonding strength. Weldbond® original Quick-Settle technology brings the revolutionary breakthrough for rapid automated assembly lines in a series of application fields.
Weldbond® LTCA products are one-component and low temperature curable epoxy adhesives, which can cure at low temperature and offer excellent bonding strength and perfect reliability. They are mainly applied in bonding reinforcement, waterproof sealing and components protection for intelligent electronic products. These adhesives also can be compatible with heat-sensitive electronic components. For fingerprint module assembly and camera module assembly, Weldbond® products can cure fast at low temperature and offer high bonding strength, low shrinkage and excellent reliability performance.
Weldbond® underfill products are one-component, heat-curable, reworkable epoxy adhesives. These products are designed to improve the reliability for fine–pitch Chip Scale Package (CSP) , Wafer Level Chip Scale Package(WLCSP) and Ball Grid Array(BGA) assembly. For the CSP components, our products can be dispensed or jetted at room temperature（25℃）. The adhesive can quickly flow to the appropriate distance, suitable for automated assembly lines without too much extra procedures.
Weldbond® UV curable adhesives can cure fast under UV light. Our products offer good adhesion to a variety of materials，excellent reliability and are especially suitable for high-speed automated assembly lines. Weldbond® UV adhesives are mainly applied in bonding reinforcement, waterproof sealing and components protection for intelligent electronic products. For FPC reinforcement application，our UV products offer good toughness, high bonding strength and excellent reliability. For waterproof sealing in mobile phone, we also develop a series of unique UV products which provide excellent reliability and are easy to rework. Particularly, we design one re-workable UV product to protect high gloss metal surface among IPAD production process.
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